| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition for semiconductor sealing excellent in safety, reliability of humidity resistance, flame retardancy, mold release and workability. SOLUTION: This composition comprises a thermoplastic resin, a curing agent, an inorganic filler, a metal hydroxide (a) represented by formula I: m(Ma Ob ).cH2 O (M is a metal element; a, b and c are positive integers; and m is a positive number of 1 or greater) and a metal oxide (b) represented by formula II: m'(Qd Oc ) (Q is a metal element belonging to a group selected from groups IVa, Va, VIa, VIIa, VIII, Ib and IIb groups in the periodic table and is being different from M in formula I; d and e are positive numbers; and n' is a positive number of 1 or greater). It requires that the metal hydroxide (a) should have a mean particle diameter of 0.6-20μm, and that the inorganic filler should be composed of particles part of which have diameters smaller than that of the metal hydroxide (a) and should have a mean particle diameter of 0.5-10μm.
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