| 摘要 |
PROBLEM TO BE SOLVED: To obtain a phenolic resin composition excellent in molding operability while retaining an excellent moisture resistance and capable of assuring of a long term reliability by using a specific condensation type phenolic aralkyl resin. SOLUTION: This resin composition comprises (A) the condensation type phenolic aralkyl resin of formula (R is H, an alkyl; Z is -H, -CH2 -, -CH2 O-CH2 -; x, y are each an integer of 0-2 and x+y≠0; n is an integer >1), (B) an inorganic filler (preferably, silica powder having average particle size <30μm), and (C) a hardening accelerator, as the essential ingredients, preferably containing 10-40 wt.% of ingredient (A) based on the total composition, 25-90% of (B) and 0.01-5% of (C). The molding material using this composition is applied to electronic parts such as semiconductor systems, etc., and is capable of affording the excellent properties and reliability.
|
