| 摘要 |
PROBLEM TO BE SOLVED: To meet the requirements of the size reduction and thickness reduction and enable the reduction of a manufacturing cost. SOLUTION: A top plate 4 is put on a circuit board 1 on which circuit components are mounted so as to make the lower surface 5 of the top plate 4 touch a circuit component which has the highest height and a space between the circuit board 1 and the top plate 4 is filled with resin 6 to seal the circuit components. Not only an insulating plate or a metal plate but also a layered plate composed of an insulating layer and a metal layer 8 which functions as a shielding may be employed as the top plate 4. It is not necessary to prepare a place such as a molding frame, etc., and, as the top plate touches the circuit component, the size and thickness can be reduced as possible and, further, the metal layer of the layered top plate functions as a shielding and, further, improves the light shielding performance and the heat radiation performance. |
