| 摘要 |
PROBLEM TO BE SOLVED: To obtain a liquid resin composition for sealing, suitable for sealing of a slim TAB, etc., for a LCD driver, capable of reducing the bending of the sealed material without damaging operability, and further having more improved volume resistivity at a high temperature and adhesion to a tape. SOLUTION: This liquid resin composition for sealing consists essentially of (A) an epoxy resin comprising a dicyclopentadiene type epoxy resin and a novolak type brominated epoxy resin, (B) a dicyclopentadiene-modified phenol resin, (C) a solvent naphtha or propylene glycol methyl ether acetate as a solvent, (D) a fused silica having 1-20μm average particle diameter, and (E) an imidazole compound as a catalyst.
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