| 摘要 |
<p>PROBLEM TO BE SOLVED: To control growth of bubbles or cracks during a heat cycle to improve the reliability by specifying the loss elasticity modulus and complex elasticity modulus of a silicone gel for sealing or filling semiconductor elements in a case. SOLUTION: The semiconductor device comprises a semiconductor element 1 sealed or filled with a silicone gel 6 in a case 5. The gel 6 has a loss modulus of elasticity 1.0×10<3> -1.0×10<5> dyn/cm<2> at shearing frequency of 0.1 Hz, 25 deg.C and complex modulus of elasticity 1.0×10<6> dyn/cm<2> or less. If the device sealed or filled with the gel 6 having such elastic modulus ranges is subjected to a heat cycle, the creation of fubbles or cracks in the gel 6 is suppressed to avoid deteriorating the electric characteristics such as dielectric breakdown strength, etc., to provide a high reliability.</p> |
