| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor device with superior humidity-resisting reliability, where an IC-chip mounting area can be reduced without abversely affecting the packaging of another electronic component, and an IC chip and connection portions can be covered staly with resin seal member. SOLUTION: This device is constituted by respectively forming surface wiring conductor 6, an IC chip 7 connected to the surface wiring conductor 6, and a resin seal member 9 covering the IC chip 7 on the surface of a laminated body 1, formed by depositing a plurality of insulating layers 1a to 1d, while providing an internal wiring conductor 2 therebetween. A trench 8 or a projection bar 81 is provided around the IC chip 7 and connection pads 5 on the surface of the laminated body 1. Further, the resin seal member 9 is provided in the region surrounded by the trench 8 or the projection bar 81.</p> |
