| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for mounting an output semiconductor chip with high efficiency. SOLUTION: An output semiconductor chip has a first and a second surface and at least one output contact pad 141 or 142 formed on the second surface. The first surface is jointed to a base 170, which is mounted on a frame 150 installed on an insulating substrate (rid) 110. Therefore, the output semiconductor chip is surrounded by the frame 150. As for a method for mounting the output semiconductor chip, first, the flat insulating substrate 110 having at least one conductor pattern layer on a first surface facing the chip 140 is prepared. Nextly, at least one metal projection 131 or 132 having a flexibility and an expandability is formed at least on a first conductor of the conductor pattern formed on the first surface of the rid 110. After that, the projection 131 or 132 is metal-bonded to the output contact pad 141 or 142 of the chip 140 and thereby the conductor pattern of the rid 110 is connected to the chip 140. |
