PACKAGE FOR HOUSING ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To provide a package for housing an electronic component capable of completely airtightly sealing a container and normally and stably operating the electronic component housed inside the container over the long period of time. SOLUTION: This package is composed of a base body 1 provided with a frame part 2 on an upper surface outer peripheral part, a frame-like metallization metal layer 7 mounted to the upper surface of the frame part 2, a metal frame body 8 attached through a brazing filler metal 9 to the metallization metal layer 7 and a metallic cover body 3 welded to the metal frame body 8 and the electronic component 4 is airtightly housed inside. In this case, the Vickers hardness(Hv) of the brazing filler metal 9 is Hv<=70.