发明名称 Verfahren zum Rückgewinnen von Wertstoffen von gedruckten Schaltungen, auf denen elektronische Bauteile montiert sind
摘要 <p>The method of recovering valuables from a printed wiring board on which electronic components are mounted, includes the steps of (a) removing electronic components from a printed wiring board on which the electronic components are mounted, (b) polishing a surface of the printed wiring board from which the electronic components have been removed in the step (a), (c) milling the printed wiring board a surface of which has been polished in the step (b), and (d) separating milled portions of the printed wiring board into portions mainly including copper and portions mainly including resin and filler. The electronic components recovered in accordance with the method includes valuables such as gold having greater grade than natural minerals. The copper recovered in accordance with the method includes no impurities such as solder, and thus can be reclaimed as metal resource having high added value. The residual glass fiber and resin scarcely includes impurities such as solder, and thus can be reused as a filler to be used for building materials and construction materials.</p>
申请公布号 DE19619965(C2) 申请公布日期 1999.04.08
申请号 DE1996119965 申请日期 1996.05.17
申请人 NEC CORP., TOKIO/TOKYO, JP 发明人 YOKOYAMA, SADAHIKO, TOKIO/TOKYO, JP;IJI, MASATOSHI, TOKIO/TOKYO, JP
分类号 B09B5/00;B02C15/00;B09B3/00;B23K1/018;C22B7/00;H05K3/22;(IPC1-7):B09B3/00 主分类号 B09B5/00
代理机构 代理人
主权项
地址
您可能感兴趣的专利