| 摘要 |
<p>A method and an apparatus for probing signals from an integrated circuit through the back side of an integrated circuit die (401). A passive diffusion (405) is disposed in a semiconductor substrate of a flip-chip mounted integrated circuit die. The passive diffusion is coupled to a signal line (409) through a contact (407). The signal line carries the integrated circuit signal of interest. In an embodiment, the disclosed passive diffusion is oversized to reduce attenuation of signal acquired from the passive diffusion. In addition, the disclosed passive diffusion is laterally spaced from nearby diffusions in the semiconductor substrate of the integrated circuit to enable exposure of the passive diffusion with a reduced risk of damaging nearby structures in the integrated circuit die, such as for example other diffusions, during the exposing process. Moreover, the disclosed passive diffusion is laterally spaced from nearby diffusions to reduce crosstalk interference from the nearby diffusions.</p> |
