发明名称 MANUFACTURE OF FIELD EMISSION COLD CATHODE
摘要 <p>PROBLEM TO BE SOLVED: To eliminate the residue of adhesive to an end of an emitter electrode to thereby improve reliability by applying an adhesive flow prevention measure to parts of protection sheet corresponding to each emitter area under a condition where the sheet is fixed to a frame for the sheet. SOLUTION: Emitter areas 20 are arranged in matrix on a surface of a wafer 21 on which the application of wafer process is completed. A protection sheet 22 is formed by applying ultraviolet curing acrylic adhesive on one surface of basic material made of such as polyethylene, and the sheet 22 is adhered preliminarily to a frame 25 for the sheet 22. Under the condition, through a mask having openings whose sizes are almost the same as the areas 20 and which are formed at the same intervals as the areas 20, ultraviolet rays are applied for curing the adhesive to thereby form flow prevention areas. After the positions of the areas 20 and the flow prevention areas are set to match each other, the protection sheet 22 is adhered to the surface of wafer 21 to thereby protect the areas 20 from cutting water or the like.</p>
申请公布号 JPH11111162(A) 申请公布日期 1999.04.23
申请号 JP19970270001 申请日期 1997.10.02
申请人 NEC CORP 发明人 SEKO NOBUYA;MATSUZAKI TADAHIRO
分类号 H01J9/02;H01L21/301;(IPC1-7):H01J9/02 主分类号 H01J9/02
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