| 摘要 |
PROBLEM TO BE SOLVED: To prevent the junction peeling of a peripheral part by heat stress for a semiconductor chip mounted to a pad on a mounted substrate by using many arrayed solder balls. SOLUTION: Among the pads arrayed inside the semiconductor chip mounting area of a mounted substrate 100, four pieces at four corners to which stress is especially concentrated are turned to anchor pads 8a provided with a recessed part 9, and the rest are turned to normal flat pads 8f. Since a solder ball 11 deformed by hot melting at the time of mounting a semiconductor chip 10 enters the recessed part 9 deep and demonstrates an anchor effect, peeling is prevented. The recessed part 9 reflects the cross-sectional profile of an opening 7a2 for an anchor formed at an insulation film 7 of a second layer. When at least a part of the pads 8a for the anchor is formed right above a via hole 5v2 buried in the insulation film, the stronger anchor effect is obtained. |
