| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit board connecting member, wherein dust is hard to be attached to a released film. SOLUTION: A member 100 comprises a prepreg 102 having released films 101 on both surfaces. On the main surfaces of the released films 101 separated from the prepreg, antistatic layers 103 are provided. Thus, the generation of static electricity is suppressed, and the circuit board connecting member having the excellent dust-attachment preventing property can be obtained. By using this connecting member, a through hole is formed at a desired position of the surface. Thereafter, the released films are separated, and the prepreg is obtained. When the circuit board is connected by this prepreg, the multilayered substrate can be manufactured by the excellent productivity. |
