发明名称 APPARATUS FOR PICKING UP SEMICONDUCTOR CHIP
摘要 <p>PROBLEM TO BE SOLVED: To reduce the maintenance and check work of a semiconductor chip pickup apparatus, as well as labor and cost for replacing components thereof. SOLUTION: In a pickup apparatus which peels off a semiconductor chip from an expanding tape, using a thrusting part which is composed of a tape guide 7 having a guide face fitted to the size of the semiconductor chip, a first tubular needle holder 4a having a taper 4d, which is inserted in the tape guide 7 and gradually taperes at one end inner diameter and thread 4e cut from the other end, a second needle holder 4b which is inserted in the first needle holder 4a and holds a part of the needle 9 for thrusting off the semiconductor chip, and a screw cap 4c screwed in the thread of the first needle holder 4a to limit the motion of the second needle holder 4b, and the second needle holder 4b is pushed to the taper so as to increase the holding force of the needle.</p>
申请公布号 JPH11260892(A) 申请公布日期 1999.09.24
申请号 JP19980062714 申请日期 1998.03.13
申请人 ROHM CO LTD 发明人 SUGINO YUJI;ONO MASANORI
分类号 H01L21/67;H01L21/301;H01L21/50;H01L21/68;(IPC1-7):H01L21/68 主分类号 H01L21/67
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