发明名称 WORK HOLDING TOOL AND HANDLING METHOD OF WORK
摘要 PROBLEM TO BE SOLVED: To facilitate the mounting work and removing work of an ingot to a wire saw device by housing a work in a housing space through the front opening part of a movable rod in the state where the movable rod is rotated to a lower opening position. SOLUTION: A cage 20 having a movable rod 28 laid in the state rotated to a lower opening position is placed on this side of the upper surface of a holder part 46. The tip of the holder part 46 of a lifter 44 is moved to the position of the work plate setting member 50 of a wire saw device 42. The cage 20 on the upper surface of the holder part 46 is moved to the position of the work plate setting member 50 of the wire saw device 42 in the tip direction of the holder part 46 to house an as-cut water W set in the position of the work plate setting member 40 in the cage 20. The movable rod 28 is rotated and fixed to an upper supporting position, and the as-cut wafer W is housed and supported within the cage 20.
申请公布号 JPH11267924(A) 申请公布日期 1999.10.05
申请号 JP19980075147 申请日期 1998.03.24
申请人 SHIN ETSU HANDOTAI CO LTD;MIMASU SEMICONDUCTOR INDUSTRY CO LTD 发明人 HAYAKAWA KAZUO
分类号 B23G7/00;B28D5/00;B65G49/07;H01L21/304;H01L21/677;(IPC1-7):B23G7/00;H01L21/68 主分类号 B23G7/00
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