| 摘要 |
<p>PROBLEM TO BE SOLVED: To reduce jig cost and man-hours by eliminating the need for the insert molding, etc., with a precision die by forming a light screen film on a seal resin surface, reduce the components cost by eliminating the need for screen frames for moldings, and to eliminate the need for the screen frame adhesion step and the associated control of adhesives. SOLUTION: This photoreflector has a structure such that a light-emitting element 2 and photosensor element 3 are mounted on a substrate 9, a light- permeable encapsulating resin 11 is filled for encapsulating the elements separately, and other part of the encapsulating resin surface than light passages is covered with a light screen film 14 by the Ni plating, etc. The manufacturing method uses a filch board on which many light-emitting elements and photosensor elements are mounted with an encapsulating resin filled for encapsulating the elements separately, a light screen film is formed on the encapsulating resin surface through the electroless Ni plating, etc., while leaving light passages and this assembly is cut crosswise into many photoreflectors.</p> |
