| 摘要 |
PROBLEM TO BE SOLVED: To provide an alignment high-speed processing mechanism, which is capable of enhancing an alignment mechanism in utilization efficiency, alignment processing speed, and throughput. SOLUTION: An alignment high-speed processing mechanism is equipment with a transfer mechanism 11, which transfers a semiconductor wafer W and an alignment mechanism 12, which aligns the semiconductor wafer W transferred via the transfer mechanism 11 in a prescribed orientation, wherein the semiconductor wafer W is delivered from the transfer mechanism 11 to the alignment mechanism 12 through the intermediary of a buffer mechanism 13. |
