发明名称 IVH SUBSTRATE, AND ITS MANUFACTURE
摘要 <p>PROBLEM TO BE SOLVED: To enable the mechanical coupling between both boards and the electric connection between circuits at the same time, by connecting the wiring patterns on each printed wiring board with one another by an anisotropic conductive sheet where conductive particles are dispersed in an insulating sheet or an adhesive. SOLUTION: An IVH hole 12 is made in the substrate core material 11 where a copper thin film 11b is made on the surface of a glass epoxy substrate 11a, and then a panel copper-plated layer 13 is made. The copper-plated layer 13 is etched to form an inner-layer circuit (wiring pattern) 14, and then resist 15 is applied on the section excluding the copper-plated section to connect with the inner-layer circuit on other board. When counterposing and coupling the fellow inner-layer circuits 14 of two sheets of printed boards 11A manufactured this way, an anisotropic conductive sheet (connection means) 16 is used. Next, the two sheets of boards 11A and 11B having sandwiched an anisotropic conductive sheet 16 are pressed into a multilayer, thus electrically connecting by the conductive particles 16a being pressurized at the inner-layer circuit part, that is the sections of a land 14a and a through hole 14b where resist 15 is not applied, and a circuit is made between both inner-layer circuits.</p>
申请公布号 JPH11298148(A) 申请公布日期 1999.10.29
申请号 JP19980121886 申请日期 1998.04.15
申请人 TOYO COMMUN EQUIP CO LTD 发明人 HARADA SHIGEO
分类号 H05K3/32;H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K3/32
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