| 摘要 |
PROBLEM TO BE SOLVED: To provide a structure which enables two or more same chips to be laminated readily. SOLUTION: The device D is a lamination type semiconductor device wherein a lead frame 105 is provided, an IC is formed above and below it and a first semiconductor chip 101 and a second semiconductor chip 103 wherein a bonding pad is formed in almost the same place inside a chip surface are arranged. A position for wire bonding of the first semiconductor chip 101 and the lead frame 105 is led out from a position of a bonding pad 101a of the first semiconductor chip 101 to a position apart inside a chip surface by a lead wire 125. In the position, the lead frame 105 and the lead wire 125 are subjected to wire bonding, and the second semiconductor chip 103 and the lead frame 105 are subjected to wire bonding to the lead frame 105 at a position of the bonding pad 103a of the second semiconductor chip 103. |
