| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor package which is not restricted by design when the package is industrially produced, has a superior heat dissipating property, and can be manufactured through a simple process and the manufacturing cost of which does not increase much. SOLUTION: A semiconductor package is formed by using a multilayered organic base material formed by laminating one or more copper foil pairs each of which is obtained by bonding two sheets of black oxide-treated copper foil 1 carrying circuits to each other with an adhesive sheet. Therefore, the heat dissipating property of the package can be improved and, even when island- like portions surrounded by continuous and overlapping clearance holes are produced, the coming off of the package can be prevented, because the package is held by a holding layer 2. In addition, no restriction is imposed on the package even at the time of designing fine circuits.</p> |
