发明名称 MANUFACTURE OF PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To prevent gradually quench repellents and decrease in repelling effect since blotting is very likely to occur, maintenance of quality is made difficult, and ultraviolet accumulated light quantity, temperature and time which are higher than those in normal cases become necessary at applying/forming, since a large amount of repelling materials are mixed in an electronic component material that contains repellents used in printed wiring boards for harmful insect countermeasure. SOLUTION: A printed wiring board, where a conduction layer 2 is selectively applied/formed on at least one of an insulating layer 1 and an electronic component material 5 as a coating that contain repellent on at least one printed wiring board having the insulating layer, is installed. Thus, the manufacture of the printed wiring board, which can improve productivity and quality and can be reduced in cost and realized without spoiling the repelling effect.
申请公布号 JP2000004073(A) 申请公布日期 2000.01.07
申请号 JP19990141884 申请日期 1999.05.21
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 IWASAKI KAZUSANE
分类号 A01M29/00;A01M29/12;H05K3/28;(IPC1-7):H05K3/28 主分类号 A01M29/00
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