摘要 |
<p>PROBLEM TO BE SOLVED: To enable realizing attachment devices where discharging efficiency of heat is excellent, and heat radiation control is easy, and realizing miniaturization, thinning, improvement of productivity, multifunction and high performance. SOLUTION: Thermal connectors 3a, 4a are arranged on attachment devices 3, 4 and connected with heat conducting members 19, 20, which are connected with cooling equipment 18. Heat generated in the attachment devices 3, 4 is introduced to the cooling equipment 18 via the thermal connectors 3a, 4a and the heat conducting members 19, 20, and heat dissipation is effectively performed.</p> |