| 摘要 |
<p>PROBLEM TO BE SOLVED: To miniaturize a device by reducing a motion range of a ring holder while taking the velocity of bonding operation into consideration. SOLUTION: A ring holder 16 whereon a semiconductor pellet 3 supplied in its alignment state is mounted is movable in XY direction and a pick-up position can reciprocate and move freely along a pick-up line L in X direction. Assumed position coordinates to the ring holder 16 of the semiconductor pellet 3 to be picked up using a center C of the ring holder 16 as the coordinate origin is (x), X direction coordinates PX of a pick-up position using a reference position S set at almost a center of an X direction motion range of the ring holder 16 as the coordinate origin are a position shown by an expression PX=ax (wherein 0<a<1). X direction coordinates CX of a center position C of the ring holder 16 move to almost a position shown by an expression CX=-(1-a)x.</p> |
