| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a dicing saw for semiconductor wafer in which the spindle feed mechanism is enclosed completely with a cover in order to prevent intrusion of mist and power can be transmitted from the spindle feed mechanism to a spindle under enclosed state. SOLUTION: The cover 76 for a spindle feed mechanism 70 is enclosed with thin stripe plates 90, 92 in order to prevent intrusion of mist. Moving blocks 104, 108 of the spindle feed mechanism 70 is are coupled with a spindle 60 through the thin stripe plates 90, 92 and driving power is transmitted from the spindle feed mechanism 70 to the spindle 60 through the thin stripe plates 90, 92.</p> |
