| 摘要 |
PROBLEM TO BE SOLVED: To provide the semiconductor device, which includes a semiconductor element, bumps for outer terminals formed on the surface of the element, and the sealing layer, which covers the surface of the element, on which these bumps are formed, and which is formed so as to expose the end surfaces of the bumps, and wherein reliability is enhanced. SOLUTION: This semiconductor device 1 is formed as follows. A sealing material layer 4 covers the surface, where bumps 3 of a semiconductor 2 are formed, and is formed so as to expose the end surfaces of the bumps 3. The sealing material layer 4 is formed of the sealing material including melted silica, which exceeds 70 weight % of the total weight of the sealing material and is less than 90 weight %. It is recommended that the above described material includes epoxy resin. Furthermore, it is recommended that the average particle diameter of the above described silica is 1-50μm.
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