发明名称 HEAT-CONDUCTIVE RESIN PLATE AND FLOOR HEATING MAT USING THE RESIN PLATE
摘要 PROBLEM TO BE SOLVED: To provide a sufficient rigidity and at the same time, enable heat from a heat source plate under a mat to be efficiently conducted to a matting and also minimize the generation of warpage and a dimensional change without humidity absorption by using a heat-conductive resin plate obtained by molding a pressed mixture of metallic fragments and a synthetic resin in the form of a plate as a mat floor. SOLUTION: In a floor heating mat 11 consisting of a mat floor 12 and a matting 13 bonded to the surface of the mat floor 12, the mat floor 12 is constituted of a heat-conductive resin plate which is formed of a platelike pressed mixture of metallic fragments of aluminum cutting and working tailings and a heat-setting epoxy resin and has 13-20 mm thickness. In addition, when the heat-conductive resin plate is molded, its weight can be further reduced by adjusting the quantity of the resin and the amount of compression to form the porous heat-conductive reins plate. At the same time, it is possible to further enhance the heat conductivity by the air which is present in a space part.
申请公布号 JP2000037741(A) 申请公布日期 2000.02.08
申请号 JP19980209955 申请日期 1998.07.24
申请人 HOT SERVICE SHA:KK 发明人 HINO YOSHIKUNI
分类号 E04C2/20;B29C43/02;B29K105/16;B29K505/00;E04F15/02;F24D3/16;(IPC1-7):B29C43/02 主分类号 E04C2/20
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