| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayer printed wiring board, which can fill a resin in through holes formed in an internal layer base material simply and the good filling efficiency of the resin, and raises the reliability of the formed multilayer printed wiring board. SOLUTION: When a filler is formed as a molded body by compression molding the filler only at 300 kg/cm2, the mean grain diameter of the filler before the compression is held also after the compression molding and as the filler, such a filler that the volume fraction of the filler in the above molded body becomes 70 volume % or higher is used. A resin composition 4 containing such the filler by 5 to 60 volume % is coated on a base material 3 to obtain a resin- attached base material 5. This resin-attached base material 5 is superposed on an internal layer material 2 formed with through holes 8 in such a way that the composition 4 provided with the resin-attached base material 5 opposes to the material 2, is laminated on the material 2 by heating, pressing and molding, and is formed integrally with the material 2. |
