| 摘要 |
PROBLEM TO BE SOLVED: To provide a ceramic circuit board for improving solder wettability for surface wiring, reducing degradation in reliability of conductor adhesion strength, and reducing a base body bend even at the time of forming the surface layer wiring of an Ag-based material on a base body composed of a glass- ceramic material. SOLUTION: This board is constituted by forming plural dielectric materials composed of a glass component and a ceramic component on the base body 1 by the simultaneous calcination of the Ag-based surface layer wiring 2 and the base body 1. In this case, the surface layer wiring 2 contains 0.2-1.0 wt.% of V2O5 and 0.1-1.5 wt.% of MoO3 to the Ag-based conductor material 100 wt.%. |
