| 摘要 |
<p>PROBLEM TO BE SOLVED: To prevent fused solder from being attracted by both side surface electrodes, by forming the side surface electrodes which electrically connect lower surface electrodes and an element on the upper surface of an insulating substrate, on side surfaces of the insulating substrate, and forming heat-resistant insulating layers on the surfaces of the side surface electrodes. SOLUTION: On the upper surface of an insulating substrate 1, upper surface electrodes 3, 4 are electrically connected to both sides of a resistance film 2, and the resistance film 2 is covered with a cover coat 5. A pair of right and left lower surface electrodes 6, 7 are formed on the lower surface of the insulating substrate 1, and side surface electrodes 8, 9 which electrically connect the upper surface electrodes 3, 4 and the lower surface electrodes 6, 7 are formed on both of the right and the left end surfaces of the insulating substrate 1. Insulating layers 15 formed of glass or synthetic resin are formed on the surfaces of both of the side surface electrodes 8, 9. As a result, fused solder positioned between both of the lower surface electrodes 6, 7 and the respective electrode pads 11 can be prevented from being attracted in the directions of the respective side surface electrodes 8, 9.</p> |
