| 摘要 |
PROBLEM TO BE SOLVED: To sufficiently heat up an anisotropic conductive adhesive which sticks out to a semiconductor chip surrounding, when thermocompression-bonding the semiconductor chip on a circuit board via the anisotropic conductive adhesive is applied in an area wider than that of the semiconductor chip. SOLUTION: A hot air duct 24 is installed around a bonding tool 23, etc. At thermocompression bonding, hot air is blown onto an anisotropic conductive adhesive 31 sticking out to a semiconductor chip 29 surrounding. Thereby, the anisotropic conductive adhesive 31 sticking out to the semiconductor chip 29 surrounding sides of it can be heated sufficiently. |
