| 摘要 |
<p>A module is provided that includes an integrated circuit chip having a first planar upper surface and a first planar lower surface having a first plurality of electrical contacts disposed thereon. The module also has an interconnect substrate having a second planar upper surface abutting the first planar lower surface, with the second planar upper surface having a second plurality of electrical contacts disposed thereon and electrically connected to selected electrical contacts of the first plurality of electrical contacts. A backside structure is provided that connects the first planar upper surface of the integrated circuit chip and the second planar upper surface of the interconnect substrate.</p> |
