发明名称 CAP BONDING JIG
摘要 <p>PROBLEM TO BE SOLVED: To efficiently adhere a cap to a substrate at a high quality by providing a means for locking a cap positioning plate to a guide pin apart from the substrate after the substrate is heated. SOLUTION: A guide pin 42 is erected on a substrate fixing plate 28 and inserted in a positioning hole 40 to position a cap positioning plate 38 on a ceramic substrate 1. The guide pin 42 is composed of a pin and a lock spring 45, the pin is circularly columnar, an insertion guide is formed at the top of a positioning part, and a groove 44 is provided for a spring 45 for locking in the axial direction. When a lift-up pin lifting the cap positioning plate 38 returns to an original position after a cap 5 is adhered to the ceramic substrate 1, the locking spring 45 blocks the plate 38 at the top end of the guide pin 42 from again inserting the adhered cap 5 into the guide hole 39. Thus, an external force due to the thermal deformation is not exerted on the ceramic substrate 11 and the cap 5 to avoid breaking, cracking, etc.</p>
申请公布号 JP2000124340(A) 申请公布日期 2000.04.28
申请号 JP19980296863 申请日期 1998.10.19
申请人 FUJITSU TEN LTD 发明人 WATANABE HIROMICHI;UNO YUJI;SATO KAZUNORI;AKAMATSU TOSHIMASA
分类号 H01L21/68;H01L23/02;H01L23/10;(IPC1-7):H01L23/02 主分类号 H01L21/68
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