| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a resin-sealed circuit device in which two or more electronic elements are formed in one package. SOLUTION: A first constituent body 1 is formed in such a way that terminal parts of a first electronic element 12 which is installed at the element mounting part of a first lead frame 11 are connected electrically to lead parts 11b of the first lead frame 11. In addition, a second constituent body 2 is formed in such a way that terminal parts of a second electronic element 22 which is installed at the element mounting part of a second lead frame 21 are connected electrically to lead parts 21b of the second lead frame 21. The rear side of the first constituent body 1 and that of the second constituent body 2 are faced with each other. The lead parts 11b of the first lead frame 11 are brought into contact with the lead parts 21b of the second lead frame 21 so that the lead parts are set to electric continuity. Inner lead parts in the electronic elements 12, 22 and the lead parts 11b, 21b are sealed with a resin 3.</p> |
