| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a surface mounting joint member which can cope with a demand of reduction in a gap between electrodes of an electronic part and a printed circuit wiring board caused by a demand of miniaturization and thinner dimension of electronic equipment. SOLUTION: A surface mounting joint member 10e, when an electronic part such as an integrated circuit element 14 or a semiconductor device is mounted on a printed circuit board 11, is made of a creamy mixture obtained by kneading solder powder 10b provided between an electrode pad 15 of the electronic part and a connection pad 12 of the board for electrically joining these together, a heat resistive resin higher in melting temperature than the solder powder, and flux as main material balance. In this case, the resin contains resilient fine particles 10c of spherical shapes having diameters not smaller than 0.5μm and less than 3μm. Under a condition that connection is established between the electrode and connection pads, resilient flux solder 10f is formed in which the fine particles of the spherical shape resin are uniformly dispersed in solder metal 10 g having solder powder melted and set therein.</p> |
