| 摘要 |
PROBLEM TO BE SOLVED: To prevent the peeling of a conductor layer and an interlayer resin insulating layer and the crack of the interlayer resin insulating layer with a heat cycle condition and high temperature, high pressure and high humidity conditions by forming roughened layers on a part of the surface of the lattice- like conductor layer and connecting a via hole. SOLUTION: A lattice-like conductor layer operates as a power layer or a ground layer and roughened layers 5 are formed at least on a part of a conductor layer. The conductor layer is closely stuck to an interlayer resin insulating layer through the roughened layers 5. Thus, the conductor layer and the interlayer resin insulating layer are not peeled off even with a heat cycle condition and high temperature, high voltage and high humidity conditions. Since the lattice-like conductor layer operates as the power layer or the ground layer, a via hole 140 is connected but the lattice-like conductor layer is formed. Thus, superior adhesion property with the via hole 140 is given. The lattice-like conductor layer is formed of an electroless plating film and an electrolytic plating film. |
