发明名称 Selective deposition and co-deposition processes for ferromagnetic thin films
摘要 A method for selectively depositing a ferromagnetic layer on a conducting layer, includes providing a substrate including a conducting layer; preparing a solution including a metal salt; adding a complexing agent to the solution; adding a reducing agent to the solution; while a temperature of the solution is less than 75° C., immersing the substrate in the solution for a predetermined period to deposit a ferromagnetic layer on the conducting layer by electroless deposition, wherein the ferromagnetic layer comprises one of cobalt (Co), iron (Fe) or CoFe; and after the predetermined period, removing the substrate from the solution.
申请公布号 US9476124(B2) 申请公布日期 2016.10.25
申请号 US201514589487 申请日期 2015.01.05
申请人 LAM RESEARCH CORPORATION 发明人 Joi Aniruddha;Chen Ernest;Dordi Yezdi
分类号 B05D5/12;C23C18/52;C23C18/50;C23C18/31;H01L43/12;C23C18/32 主分类号 B05D5/12
代理机构 代理人
主权项 1. A method for selectively depositing a ferromagnetic layer on a conducting layer, comprising: providing a substrate including a conducting layer; preparing a solution including a metal salt; adding a complexing agent to the solution; adding a reducing agent to the solution, wherein the reducing agent comprises titanium trichloride and does not include any one of hypophosphite, borohydride, and dimethylamine borane; while a temperature of the solution is less than 50° C., immersing the substrate in the solution for a predetermined period to deposit a ferromagnetic layer on the conducting layer by electroless deposition, wherein the ferromagnetic layer comprises one of cobalt (Co), iron (Fe) or CoFe; and after the predetermined period, removing the substrate from the solution.
地址 Fremont CA US