| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a circuit board for semiconductor package which is particularly suitable for a semiconductor package for CSP mounted on small-sized portable equipment, etc., and has external terminals having improved drop impact resistances, and can be manufactured at a low cost, and a semiconductor package using the circuit board. SOLUTION: For a perforated circuit board for semiconductor package on one surface of which an IC chip is mounted and on the other surface of which outside connecting electrodes are provided in an area array-like state, the IC chip mounting side of holes made through the circuit board are closed with an IC chip mounting pattern 15, and, at the same time, outside connecting electrode surface patterns 14 are provided around the holes on the surface of the board on which outside connecting electrodes are provided.</p> |
