Method for interconnecting an electronic device using a removable solder carrying medium

摘要

In accordance with the invention, an electronic device (9) having one or more contact pads (12) is adhered to an array of transferable solder particles (31) on a removable carrier sheet (32). The carrier is removed, as by dissolving, leaving solder selectively adhered to the contact pads. In a preferred embodiment the solder-carrying medium is water soluble, and the solder particles comprise solder-coated magnetic particles. Application of a magnetic material while the medium is drying or curing, produces a regular array of solder-coated particles. Using this method, devices having smaller than conventional contact structures can be readily interconnected.