PRINTED CIRCUIT BOARDS WITH SOLID INTERCONNECT AND METHOD OF PRODUCING THE SAME

摘要

A printed circuit board with a solid metallic interconnect (62) which gives a stable and effective electrical interconnection between metallic layers (58, 64) separated by one or more dielectric layers (56). The method of producing the interconnect involves creating the solid metallic interconnect (62) by metallic plating on the base copper (58) at the interconnecting location (60), followed by the lamination of the appropriate dielectric layer (56). This dielectric layer may have a pre-cut hole (60) corresponding to the solid metallic interconnect (62), which is registered with the interconnect before lamination. A layer of dielectric polymer is then removed from the interconnect by traditional methods. This is followed by electroless plating and conventional metallization and circuitry formation. This process may also be applied to interconnect which spans more than one dielectric layer (56).