发明名称 MODULE CAPABLE OF FIELD REPLACEMENT WITH IMPROVED HEAT CONTACT FACE
摘要 PROBLEM TO BE SOLVED: To provide a module capable of field replacement which has a part to slide-contact with low heat resistance with a heat sink, which does not require contact pressure to secure contact, and which is tolerant to arrangement inferiority, easy of manufacture, and is easy of maintenance, and is replaceable. SOLUTION: This module 100 capable of field replacement has a heat sink 111 which has a main face and a finger-shaped part extending longitudinally from this main face, and a part 101 which has a main face and a finger-shaped part arranged to contact, finger-to-finger, with the finger-shaped part of the heat sink 111. Thus, this module shifts heat to the heat sink 11.
申请公布号 JP2000228470(A) 申请公布日期 2000.08.15
申请号 JP20000016853 申请日期 2000.01.26
申请人 HEWLETT PACKARD CO <HP> 发明人 CHRISTIAN L BIREDEII
分类号 H01L23/36;H05K7/20;H05K9/00;(IPC1-7):H01L23/36 主分类号 H01L23/36
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