| 摘要 |
PROBLEM TO BE SOLVED: To obtain an epoxy resin composition for semiconductor sealing use which is excellent in a balance between the high-temperature preservation characteristics and flame retardancy. SOLUTION: This epoxy resin composition for semiconductor sealing use essentially comprises an epoxy resin, a phenolic resin, 0.1-5 wt.% zeolite with 3-20Åin pore diameter and 0.1-0.4 cm3/g in pore volume, 0.1-5 wt.% hydrotalcite, a bromine compound, an inorganic filler and a curing accelerator, wherein the amount of the bromine compound is such that the bromine level accounts for 0.1-1.5 wt.% of the whole epoxy resin composition. |
