THERMOSETTING RESIN COMPOSITION AND SEMICONDUCTOR DEVICE PREPARED BY USING SAME

摘要

PROBLEM TO BE SOLVED: To obtain a thermosetting resin composition in which each compounding ingredient is homogeneously dispersed and which suppresses the formation of voids and is excellent in storage stability and resistance to soldering by compounding a thermosetting resin with a curing agent and a cure- acceleration-containing microcapsule having a core/shell structure. SOLUTION: This composition comprises a thermosetting resin (A) (e.g. an epoxy resin having an epoxy equivalent of 150-350 and a softening point of 50-150 deg.C); a curing agent (B) having a hydroxyl equivalent of 150-220 and a softening point of 50-90 deg.C in such an amount that the amount of hydroxyl group is 0.8-1.2 equivalents, preferably 0.9-1.1 equivalents, per equivalent of epoxy group of ingredient A; and a cure-accelerator-containing microcapsule having a core/shell structure (C) in an amount of 0.1-3 pts.wt. (based on 100 pts.wt. ingredient A) having an average capsule size of 0.05-20μm and comprising 5-70 wt.% cure accelerator as the core part and shells which cover the accelerator and comprise a polyurea formed by using a mixture of 80-30 mol% isocyanate compound of formula I and 20-70 mol% isocyanate compound of formula II.