发明名称 |
Light-emitting diode |
摘要 |
In a light-emitting diode, a substantially square flip chip is placed on a substantially square sub-mount at a position and posture which are obtained through superposition of a center point and center axis of the flip chip on a center point and center axis of the sub-mount and subsequent rotation of the flip chip about the center points by approximately 45°. Therefore, triangular exposed regions are formed on the sub-mount, in which two lead electrodes for the flip chip can be formed. As a result, the flip chip can be placed on a lead frame such that the center axis of the flip chip coincides with the center axis of a parabola of the lead frame. Further, the sub-mount is formed of a semiconductor substrate, and a diode for over-voltage protection is formed within the semiconductor substrate. Therefore, breakage of the light-emitting diode due to excessive voltage can be prevented. |
申请公布号 |
EP1030377(A2) |
申请公布日期 |
2000.08.23 |
申请号 |
EP20000101575 |
申请日期 |
2000.01.27 |
申请人 |
TOYODA GOSEI CO., LTD.;KOHA. CO., LTD. |
发明人 |
HIRANO, ATSUO;YOSHIKAWA, YUKIO;TESHIMA, KIYOTAKA;YASUKAWA, TAKEMASA |
分类号 |
H01L33/06;H01L33/28;H01L33/32;H01L33/34;H01L33/36;H01L33/38;H01L33/40;H01L33/44;H01L33/48;H01L33/56;H01L33/60;H01L33/62 |
主分类号 |
H01L33/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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