发明名称 METHOD AND APPARATUS FOR SURFACE TREATMENT OF SUBSTRATE AND SURFACE-TREATED SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To enable efficient, uniform surface treatment at a high efficiency of giving a polar functional group a substrate and improve the adhesivity of the substrate, even when the substrate is conveyed at a high speed. SOLUTION: In a surface treatment method of a lengthy substrate 1, a treatment part 2 for plasma-treating the substrate 1 continuously conveyed continuously under the atmospheric pressure or a pressure close to the atmospheric pressure is provided. The treatment part 2 is a treatment chamber having the inlet and outlet of the substrate 1. In the surface treatment of the substrate 1 by plasma generated by forming a pulsing electric field in the substrate 1 in the treatment chamber, the percentage of reaction gas in treatment gas to be seal in the treatment chamber is at least 30%, and the pressure of the treatment chamber is set up to be higher than the atmospheric pressure.
申请公布号 JP2000246091(A) 申请公布日期 2000.09.12
申请号 JP19990374256 申请日期 1999.12.28
申请人 KONICA CORP 发明人 KONDO YOSHIKAZU;FUKUDA KAZUHIRO
分类号 C08J7/00;B01J19/08;G03C1/00;G03C1/77;G03C1/795;G03C1/91;(IPC1-7):B01J19/08 主分类号 C08J7/00
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