| 摘要 |
PROBLEM TO BE SOLVED: To obtain a manufacturing method of a surface acoustic wave device with excellent reliability where no defective brazing is caused in a metallic bump bonding part by decreasing a stress applied to the metallic bump bonding part in the case of brazing a base member and a cap member. SOLUTION: A surface acoustic wave device 20 and a base member 10 are bump-bonded by using a metallic bump 51 whose melting point is 450 deg.C or over, a brazing filler metal 52 is used for bonding between the base member 10 and a cap member 30 and the brazing material 52 is molten by uniformly heating the entire components to reach a temperature higher than the melting point of the brazing filler metal 52 and to bond the base member 10 and the cap member 30. |
