| 摘要 |
PROBLEM TO BE SOLVED: To form a semiconductor element having no deformation even when a wafer is divided by a brake blade. SOLUTION: In this manufacturing method, an electrode 40 is formed on the surface of a wafer 10 as not to be projected thereover, and scribe points are slided on the surface of the wafer 10 so that the electrodes are formed continuously thereon. Then a brake blade is pressed on the wafer 10 from the upper side of a scribe line so as to divide it into semiconductor elements. Since the scribe line is formed continuously, no crack is generated on the surface of the wafer 10 and the wafer 10 can be divided along the extension line of the scribe line 60 on the surface of the wafer 10. Therefore, a semiconductor element having no deformation and an almost rectangular and uniform shape can be manufactured. |
