| 摘要 |
PROBLEM TO BE SOLVED: To decrease uneven adhesive strength of a carrier tape and a cover tape by pressing it roughly equally. SOLUTION: This is packaging equipment where a semi-conductor device is stared and a carrier tape 26 is placed storing in its storage part 27 and covered with a cover tape 36 between a top side block 32 mounted on a top mold main body 23 and a bottom side block 24 mounted on a bottom mold main body 22, and while both tapes are sent in the longitudinal direction, the same are pressed by both blocks and are adhered by an adhesive agent 35 applied along both side edges. The bottom block 24 is mounted on the recess 28 of the bottom mold main body 22 through an inclination correction mechanism 25. The inclination correction mechanism 25 supports a support bar 29 fixed on the bottom face of the bottom side block 24 enabling the same to swing in a predetermined range in a support hole 30 formed in the bottom mold main body 22, and a spring 31 for energizing the bottom side block 24 in a pressing direction is provided between the bottom side block 24 and the recess 28 bottom face of the bottom mold main body 22.
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