| 摘要 |
<p>PROBLEM TO BE SOLVED: To reduce warpage and undulation of a lead frame by using a thermoplastic adhesive as an adhesive used for forming a multilayer structure. SOLUTION: The side of a heat spreader 3 of the completed product of a lead frame 10 with a heat sink is set onto a heating plate 8 for reducing warpage and is heated, so that the entire lead frame 1 becomes flat at a temperature at which a thermoplastic adhesive becomes soft. Then, when the lead frame 1 becomes flat by heating, heating is stopped, the lead frame 1 is moved onto a cooling plate 9 for reducing warpage from the heating plate 8 for reducing the warpage, thus cooling the side of the heat spreader 3. A heat treatment is conducted so that the amount of thermal expansion of each member becomes equal at junction temperature where the adhesive becomes hard.</p> |
