| 摘要 |
PROBLEM TO BE SOLVED: To replenish without excessive or insufficient a sealing resin between a semiconductor element and a substrate in a semiconductor mounter, on which the semiconductor elements are mounted on the substrate provided with clearances. SOLUTION: A semiconductor element 10 is electrically and mechanically connected to one main face of an interposer substrate 20 by the use of bump electrodes 30. The interposer substrate 20 is provided with a through-hole 22 for supplying a sealing resin 40. At a supply port side of the through-hole 22, a cylindrical recess 23 is formed as a replenishment amount buffer. |
