SEMICONDUCTOR MICROVALVE

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor mirovalve having a large displacement amount of a flexible portion and capable of providing a good sealing characteristic. SOLUTION: This semiconductor microvalve is provided with a second silicon substrate 20 having a valve element 23 for opening/closing a valve port 10a penetratingly provided on the first silicon substrate 10. The second silicon substrate 20 is provided with a diaphragm-like flexible portion 22 having a flexibility supported to a supporting portion 21 joined to a peripheral portion 11 of the first silicon substrate 10 and a valve element 23 leaving/contacting broom/to a valve seat 13 corresponding to the flexibility of the flexible portion 22. A bimetal element film 24 comprising a metal thin film is laminated on the flexible portion 22. The bimetal element film 24 constitutes a bimetal with the flexible portion 22. The bimetal constitutes a driving portion for deforming the flexible portion utilizing a thermal expansion. In the flexible portion 22, a plurality of small holes 25 are formed in a net shape at a position excepting for a position corresponding to the valve element 23 and the bimetal element film 24.